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AUTOMATION PRODUCTS  & SERVICES

CUSTOMIZED EQUIPMENTS & SERVICES

DUO-KANG has an expertise team of automation and will be your solid consulter in the beginning phase for providing reliable solutions, designing and building up model/sample in accordance with GAMP5 or SEMI S2/S26 standards.



ADVANTAGE

Introductuion
We’re serving on automatic equipment of PC-Base, PLC-Base and Embedded System. Such as combining machine vision, motion control, I/O, robots, process control etc. In very skillful and capable to design, develop specified equipment for fulfilling your requirement.


Services

- Automatic System Analysis.

- Automatic System Integration.

- Automatic / Semi-automatic Equipments Design & Build Up.

- Based on PC, PLC or Embedded System Control.

- Software Programming.

- Coding / Decoding Process

- I/O Interface / Machine Vision / Motion Control Desgin.

- Fixture Design & Build Up.

- DQ / IQ / OQ / PQ Process.



300 mm (12") WAFER BONDEING SYSTEM (DWB-300B)

The wafer bonder can bonding the wafer to the carrier with adhesive at the specific high temperature and bonding pressure for all wafer bonding processes such as anodic, e.g. compression, fusion bonding... plasma bonding.   that can handle  substrate pieces up to 300mm (12") wafers.



ADVANTAGE

Introduction
The DWB-300B Wafer Bonding System is a highly flexible R&D system, bonding the wafer to the carrier with adhesive at the specific high temperature and bonding pressure for all wafer bonding processes such as anodic, e.g. compression, fusion bonding... plasma bonding. that can handle  substrate pieces up to 300mm (12") wafers.
The equipment supports a variety of bonding processes, such as anodic, glass frit, eutectic, diffusion, fusion, solder,and adhesive bonds, as well as other thermal processes, including oxide removal and high temperature bakes under a controlled atmosphere. The system also offers quick re-tooling with a conversion time of less than 10 minutes, making it ideal for small-volume production as well as universities and R&D applications.


Features
- Programmable by bond force controller.
- Have pressure meter with show bonding of pressure.
- Bonding pressure : 1000N - 20000N (Max)

- Bonding pressure force control accuracy: <+/- 3%

- Bonding temperature : 500°C (Max)
- Bonding temperature accuracy: <+/- 2%
- Bonding uniformity test : <+/- 3%
- Down to 5.0 X 10¯5mbar with turbo molecular pump for High-vacuum capable

  bond chamber.
- Open chamber design for fast conversion and maintenance.
- Operation interface by Windows based control software.

 


200 mm (8") WAFER BONDING SYSTEM (DWB-200A)

The wafer bonder can bonding the wafer to the carrier with adhesive at the specific high temperature and bonding pressure for all wafer bonding processes such as anodic, e.g. compression, fusion bonding... plasma bonding.   that can handle  substrate pieces up to 200mm (8") wafers.



ADVANTAGE

Introduction
The DWB-300B Wafer Bonding System is a highly flexible R&D system, bonding the wafer to the carrier with adhesive at the specific high temperature and bonding pressure for all wafer bonding processes such as anodic, e.g. compression, fusion bonding... plasma bonding. that can handle  substrate pieces up to 200mm (8") wafers.
The equipment supports a variety of bonding processes, such as anodic, glass frit, eutectic, diffusion, fusion, solder,and adhesive bonds, as well as other thermal processes, including oxide removal and high temperature bakes under a controlled atmosphere. The system also offers quick re-tooling with a conversion time of less than 10 minutes, making it ideal for small-volume production as well as universities and R&D applications.


Features
- Programmable by bond force controller.
- Have pressure meter with show bonding of pressure.
- Bonding pressure : 1000N - 20000N (Max)

- Bonding pressure force control accuracy: <+/- 3%

- Bonding temperature : 500°C (Max)
- Bonding temperature accuracy: <+/- 2%
- Bonding uniformity test : <+/- 3%
- Down to 5.0 X 10¯5mbar with turbo molecular pump for High-vacuum capable

  bond chamber.
- Open chamber design for fast conversion and maintenance.
- Operation interface by Windows based control software.





CORE VALUE
 

 

 

 

SINCERE、LOVE、ENERGETIC、PRECISE、TRUTH

 

DUO-KANG CO., LTD DEVELOPED A SET OF CORE VALUE TO SERVE OUR PARTNERS AND CUSTOMERS. THIS CORE VALUE IS BASED ON FIVE KEY CONCEPT : SINCERE、LOVE、ENERGETIC、PRECISE AND TRUTH. WE BUILD UP AND INSIST IN THESE CORE VALUES DURING OUR BUSINESS RUN AND GROWTH.

 

S

L

E

P

T

 

“SINCERE” IS TO ACCOMPLISH CUSTOMER’S MISSION WITH GENUINE AND HONESTY.

 

“LOVE” IS TO TREAT EVERY CONSUMER WITH HEART ENSURING THAT THEY CAN RECEIVE BETTER CARE.

 

 

“ENERGETIC” IS ABOUT AFFECTION AND SPIRIT MAKING DUO-KANG TO BE SUSTAINABLE BUSINESS PARTNER.

 

 

“PRECISE” IS TO ENDEAVOR PUTTING EFFORTS ON RESEARCH AND DEVELOPMENT TO FULFILL CUSTOMER EXPECTATIONS, BEING BETTER AND BETTER.

 

 

“TRUTH” IS TO SEEK TRUTH FROM FACTS. COPE WITH AND HANDLE ISSUES CORRECTLY WITHOUT EXAGGERATION OR UNDERSTATEMENT.

 

 

 

 

 

 

 

 

 

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